Tianjia New Material Technology (Hubei) Co., Ltd
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회사 뉴스 Advanced Cleanroom Solutions for Semiconductor and Electronics Industries
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Advanced Cleanroom Solutions for Semiconductor and Electronics Industries

2026-05-07

에 대한 최신 회사 뉴스 Advanced Cleanroom Solutions for Semiconductor and Electronics Industries

Tianjia Advanced Modular Cleanroom for Semiconductor & Electronics: Stable Support for Advanced Processes

 

In semiconductor and electronic chip manufacturing, environmental stability and cleanliness directly determine yield and performance. Tianjia’s modular cleanroom, certified to ISO 9001, CE and GMP, is specially designed for advanced processes, providing precise dust-free environments from Class 100 to Class 10,000.

 

I. Core Technical Highlights

  1. Integrates dust removal, smoke removal, humidification and sterilization, with filtration efficiency of 99.97% for 0.3μm particles, about 15% higher than ordinary cleanrooms, stably supporting 28nm and below advanced processes.
  2. Uses rock wool / PU / MGO sandwich panels with high-speed, heat-resistant, antimagnetic and anti-static properties. Ordinary cleanrooms mostly use single color steel plates and only meet basic dust prevention.
  3. Touch / remote dual-mode control for fast temperature and humidity adjustment, response speed 30% higher than manual control; modular prefabrication shortens assembly time by 40%, supporting rapid expansion.
  4. Integrated solutions with air showers, pass-through boxes and other equipment, meeting CE, GMP, ISO standards. Provides FAT, SAT and 24-hour technical support.

 

 

II. Quick Selection Guide

  1. Semiconductor Wafer Fabrication Workshop: Class 100 dust control + anti-static + constant temperature and humidity, meeting nanoscale requirements and reducing defects.
  2. Electronic Chip Packaging Workshop: High-efficiency dust removal + heat-resistant materials + electromagnetic protection, improving packaging yield.
  3. Optoelectronic Display Panel Workshop: Stable dust-free environment + precise humidity control, reducing flaws and improving display quality.
  4. Electronic Component R&D Laboratory: Biosafety protection + precise temperature and humidity control, ensuring experimental data reliability.

III. Installation Process

  1. On-site survey and customized layout with anti-static design.
  2. Factory prefabrication of components.
  3. Bolt-splicing assembly with anti-static electrical, piping and control installation.
  4. Testing and acceptance: cleanliness, temperature, humidity, airtightness and static electricity; third-party reports; FAT and SAT verification.

IV. Daily Usage Notes

  1. Replace primary and HEPA filters regularly; used filters can be professionally recycled.
  2. Avoid scratching panels; use anti-static detergents to prevent static buildup.
  3. Inspect sensors and PLC controllers quarterly.
  4. In case of alarms, troubleshoot via the panel first; contact 24-hour support.

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86--13026127338
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